Electroninks Showcases Top Industry Predictions for 2026

From AI to high-performance computing — we take a look at emerging use cases and predictions in the industry

AUSTIN, TX, UNITED STATES, January 12, 2026 /EINPresswire.com/ — Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today released its annual outlook of top trends to impact the industry, Electroninks 2026: The Top Additive Manufacturing Trends to Watch. The trends identify the next major inflection points in additive manufacturing, where organizations shift from legacy implementation to executing on new insights with cost efficiency, competitive advantages and advanced workflows at the core.

The following predictions come from Electroninks top executives and thought leaders, Brett Walker (CEO and Co-founder), Melbs LeMieux (President and Co-founder), Takashi Mochizuki (Head of Sales and Business Development), Kazutaka Ozawa (Technical Director):

1. Metal–Organic Decomposition (MOD) Inks Become a Standard Metallization Pathway

2026 will mark the first year that MOD inks transition from early-stage adoption to mainstream qualification across chip packaging lines. As fabs seek lower-temperature processes, higher reliability, and faster cycle times, particle-free printable metals will emerge as a de facto choice for backside metallization, EMI shielding, and RDL repair applications.

2. Backside Metallization (BSM) Moves to Additive-First Workflows

The rapid rise of AI accelerators and multi-die GPU architectures is pushing BSM requirements beyond the capabilities of traditional vacuum deposition tools. Additive alternatives enable faster throughput, high-aspect-ratio coverage, and better thermal conduction. In 2026, several major OSATs are expected to shift at least one production line to additive metallization.

3. Materials Equipment Co-development Becomes Industry Standard

The industry will increasingly adopt a collaborative model where materials suppliers and toolmakers co-engineer integrated solutions. This is expected to produce purpose-built additive metallization systems optimized for reliability, speed, and fully digital deposition. These vertically aligned solutions will accelerate qualification cycles and improve scalability.

4. Hybrid Packaging Architectures Drive Demand for Multi-Material Workflows

With chiplets, 2.5D interposers, and 3D stacked architectures reaching commercial scale, 2026 will usher in greater demand for materials that work seamlessly together. Printable metals, curable dielectrics, underfills, and thermal interface materials will need to integrate into unified, digitally programmable workflows that support rapid prototyping and high-mix production environments.

5. Power and Water Reduction Becomes a Global Priority as AI Data Centers Drive Infrastructure Strain

A surge in AI-dedicated data centers will create unprecedented demand for power and cooling, pushing utilities and hyperscalers into crisis-level resource constraints. In 2026, semiconductor companies will face urgent pressure to reduce energy and water use across material deposition, curing, and packaging processes. Additive metallization will gain accelerated momentum due to its ability to:

* Eliminate energy-intensive, wasteful metallization processes, especially for large area panels.

* Reduce water use by cutting out chemical etching steps.

* Lower total carbon footprint across packaging lines.

Governments and enterprise customers will reward suppliers that enable more sustainable semiconductor scaling, especially as AI workloads continue to multiply.

6. Metal-Complex Silver Inks: A New Cost-Stability Lever in a Volatile Silver Market

Record and multi-year-high silver prices are forcing every electronics and semiconductor manufacturer to rethink how much precious metal they really need in their processes. Traditional conductive materials have long depended on heavy silver loading to hit performance targets. Today, that approach is colliding with commodity volatility, budget pressure, and growing scrutiny on material efficiency.

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About Electroninks

Electroninks Incorporated is a world-leader in the commercialization of advanced materials for electronics and semiconductor packaging. We have developed a full suite of proprietary metal complex conductive ink solutions and complementary material sets, thus accelerating time to market for both new innovations and drop-in manufacturing breakthroughs.

Electroninks’ metal complex inks – including silver, gold, platinum, nickel and copper – deliver higher conductivity, manufacturing flexibility, and cost-effectiveness. The company’s conductive inks provide reliable solutions for applications in printed circuit board (PCB) manufacturing, semiconductor packaging, consumer electronics, wearables, medical devices and more. We also partner closely with best-in-class equipment and integration partners to provide customers with a total ink and process solution with the ultimate goal to reduce the manufacturing costs and complexity.

To learn more visit: www.Electroninks.com
Contact@Electroninks.com
512-766-7555

Nicolia Wiles
Prime TechPR, LLC
+1 512-477-7373
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